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MCP6441 Datasheet(PDF) 11 Page - Microchip Technology |
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MCP6441 Datasheet(HTML) 11 Page - Microchip Technology |
11 / 46 page © 2010-2012 Microchip Technology Inc. DS22257C-page 11 MCP6441/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. 3.1 Analog Output (VOUT) The output pin is a low-impedance voltage source. 3.2 Power Supply Pins (VDD, VSS) The positive power supply (VDD) is 1.4V to 6.0V higher than the negative power supply (VSS). For normal operation, the other pins are at voltages between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.3 Analog Inputs (VIN+, VIN-) The non-inverting and inverting inputs are high- impedance CMOS inputs with low bias currents. 3.4 Exposed Thermal Pad (EP) There is an internal connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be con- nected to the same potential on the Printed Circuit Board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance ( θ JA). TABLE 3-1: PIN FUNCTION TABLE MCP6441 MCP6442 MCP6444 Symbol Description SC70-5, SOT-23-5 SOIC, MSOP 2x3 TDFN SOIC, TSSOP 11 1 1 VOUT, VOUTA Analog Output (op amp A) 42 2 2 VIN–, VINA– Inverting Input (op amp A) 33 3 3 VIN+, VINA+ Non-inverting Input (op amp A) 58 8 4 VDD Positive Power Supply —5 5 5 VINB+ Non-inverting Input (op amp B) —6 6 6 VINB- Inverting Input (op amp B) —7 7 7 VOUTB Analog Output (op amp B) —— — 8 VOUTC Analog Output (op amp C) —— — 9 VINC- Inverting Input (op amp C) —— — 10 VINC+ Non-inverting Input (op amp C) 24 4 11 VSS Negative Power Supply —— — 12 VIND+ Non-inverting Input (op amp D) —— — 13 VIND- Inverting Input (op amp D) —— — 14 VOUTD Analog Output (op amp D) — — 9 — EP Exposed Thermal Pad (EP); must be connected to VSS |
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