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MPZ1608Y600B Datasheet(PDF) 7 Page - TDK Electronics |
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MPZ1608Y600B Datasheet(HTML) 7 Page - TDK Electronics |
7 / 13 page • All specifications are subject to change without notice. (6/12) 001-08 / 20120925 / e9413_mpz SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING ELECTRICAL CHARACTERISTICS 1 Test equipment: E4991A or equivalent Test tool : 16192A or equivalent Test temperature: 25±10°C 2 Please refer to the graph of RATED CURRENT vs. TEMPERATURE CHARACTERISTICS(DERATING) about the rating current at 85°C or more in temperature of the product. RATED CURRENT vs. TEMPERATURE CHARACTERISTICS (DERATING) Thickness(T) Weight 0.6±0.15mm 3mg 0.8±0.15mm 4mg Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 4000 pieces/reel 1.6±0.15 0.3±0.2 0.3±0.2 0.8 0.6 0.6 Dimensions in mm Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Part No. Impedance ( )[100MHz]1 DC resistance ( )max. Rated current2 (A)max. Thickness T(mm) MPZ1608B471A 470±25% 0.150 1.0 0.8 MPZ1608S300A 30±10 0.010 5.0 0.6 MPZ1608S600A 60±25% 0.020 3.5 0.6 MPZ1608S101A 100±25% 0.030 3.0 0.6 MPZ1608S121A 120±25% 0.045 2.0 0.6 MPZ1608S181A 180±25% 0.050 2.0 0.6 MPZ1608S221A 220±25% 0.050 2.2 0.8 MPZ1608S331A 330±25% 0.080 1.7 0.8 MPZ1608R391A 390±25% 0.120 1.2 0.8 MPZ1608S471A 470±25% 0.150 1.0 0.8 MPZ1608S601A 600±25% 0.150 1.0 0.8 MPZ1608S102A 1000±25% 0.300 0.8 0.8 MPZ1608Y600B 60±25% 0.030 2.3 0.8 MPZ1608Y101B 100±25% 0.040 2.0 0.8 MPZ1608Y151B 150±25% 0.050 1.8 0.8 MPZ1608Y221B 220±25% 0.100 1.5 0.8 MPZ1608D300B 30±10 0.060 1.8 0.8 MPZ1608D600B 60±25% 0.100 1.2 0.8 MPZ1608D101B 100±25% 0.150 1.0 0.8 0 1 2 3 4 5 6 –55 –35 –15 5 25 45 65 85 105 125 Temperature(˚C) S300A S600A S101A Y600B B471A,S471A,S601A,D101B S102A Y221B S331A R391A,D600B S221A Y151B,D300B S121A,S181A,Y101B |
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