UCC27523, UCC27524, UCC27525, UCC27526

SLUSAQ3F – NOVEMBER 2011 – REVISED MAY 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DESCRIPTION (CONTINUED)

The UCC2752x family provide the combination of three standard logic options — dual-inverting, dual-non

inverting, one inverting and one non-inverting driver. UCC27526 features a dual input design which offers

flexibility of both inverting (IN- pin) and non-inverting (IN+ pin) configuration for each channel. Either IN+ or IN-

pin controls the state of the driver output. The unused input pin is used for enable and disable functions. For

safety purpose, internal pullup and pulldown resistors on the input pins of all the devices in UCC2752x family

ensure that outputs are held LOW when input pins are in floating condition. UCC27323, UCC27324 and

UCC27325 feature Enable pins (ENA and ENB) to have better control of the operation of the driver applications.

The pins are internally pulled up to VDD for active-high logic and are left open for standard operation.

UCC2752x family of devices are available in SOIC-8 (D), MSOP-8 with exposed pad (DGN) and 3-mm × 3-mm

WSON-8 with exposed pad (DSD) packages. UCC27524 is also offered in PDIP-8 (P) package. UCC27526 is

only offered in 3-mm × 3-mm WSON (DSD) package.

PART NUMBER

PACKAGE

SOIC 8-Pin (D), MSOP 8-pin (DGN),

UCC27523

WSON 8-pin (DSD)

SOIC 8-Pin (D), MSOP 8-pin (DGN),

UCC27524

WSON 8-pin (DSD), PDIP 8-pin (P)

-40°C to 140°C

SOIC 8-Pin (D), MSOP 8-pin (DGN),

UCC27525

WSON 8-pin (DSD)

UCC27526

WSON 8-pin (DSD)

(1)

For the most current package and ordering information, see Package Option Addendum at the end of this document.

(2)

All packages use Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C peak reflow temperature to be

compatible with either lead free or Sn/Pb soldering operations. DSD package is rated MSL level 2.

TOPSIDE MARKING INFORMATION

PART NUMBER WITH PACKAGE DESIGNATOR

TOP MARKINGS

UCC27524D

27524

UCC27524DGN

27524

UCC27524DSD

SBA

UCC27524P

27524

UCC27523D

27523

UCC27523DGN

27523

UCC27523DSD

27523

UCC27525D

27525

UCC27525DGN

27525

UCC27525DSD

27525

UCC27526DSD

SCB

2

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Product Folder Links: UCC27523, UCC27524, UCC27525, UCC27526