UCC27210

UCC27211

www.ti.com

SLUSAT7C – NOVEMBER 2011 – REVISED MARCH 2012

TERMINAL FUNCTIONS

PIN

PIN NAME

DESCRIPTION

D/DDA/DRM

DPR

VDD

1

1

decoupling capacitor range is 0.22 µF to 1.0 µF.

High-side bootstrap supply. The bootstrap diode is on-chip but the external bootstrap

capacitor is required. Connect positive side of the bootstrap capacitor to this pin.

HB

2

2

Typical range of HB bypass capacitor is 0.022 µF to 0.1 µF. The capacitor value is

dependant on the gate charge of the high-side MOSFET and should also be selected

based on speed and ripple criteria

HO

3

3

High-side output. Connect to the gate of the high-side power MOSFET.

High-side source connection. Connect to source of high-side power MOSFET.

HS

4

4

Connect the negative side of bootstrap capacitor to this pin.

HI

5

7

High-side input.

LI

6

8

Low-side input.

VSS

7

9

Negative supply terminal for the device which is generally grounded.

LO

8

10

Low-side output. Connect to the gate of the low-side power MOSFET.

N/C

-

5/6

Not Connected.

Pad

Pad

(GND). Connect to a large thermal mass trace or GND plane to dramatically improve

thermal performance.

(1)

The PowerPAD™ is not directly connected to any leads of the package. However it is electrically and thermally connected to the

substrate which is the ground of the device.

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