SSM2166

Rev. D | Page 2 of 20

TABLE OF CONTENTS

Features .............................................................................................. 1

 

Applications....................................................................................... 1

 

General Description ......................................................................... 1

 

Functional Block Diagram and Typical Speech Application ...... 1

 

Revision History ............................................................................... 2

 

Specifications..................................................................................... 3

 

Absolute Maximum Ratings............................................................ 4

 

Thermal Resistance ...................................................................... 4

 

ESD Caution.................................................................................. 4

 

Pin Configuration and Function Descriptions............................. 5

 

Typical Performance Characteristics ............................................. 6

 

Theory of Operation ........................................................................ 8

 

Applications Information ............................................................ 8

 

Signal Path......................................................................................8

 

Level Detector................................................................................9

 

Control Circuitry........................................................................ 10

 

Power-Down Feature ................................................................. 12

 

PCB Layout Considerations...................................................... 12

 

Evaluation Board ............................................................................ 13

 

Evaluation Board Examples ...................................................... 14

 

Evaluation Board Setup Procedure .......................................... 15

 

Test Equipment Setup ................................................................ 15

 

Setup Summary .......................................................................... 16

 

Outline Dimensions ....................................................................... 17

 

Ordering Guide .......................................................................... 17

 

REVISION HISTORY

7/08—Rev. C to Rev. D

Changes to Figure 4 through Figure 9 ........................................... 6

Changes to Figure 11 and Figure 12............................................... 7

Changes to Figure 19...................................................................... 10

Changes to Figure 26...................................................................... 13

Added Top Branding Revision Reflecting Die Replacement

Table ................................................................................................. 17

5/08—Rev. B to Rev. C

Updated Format..................................................................Universal

Changes to Features Section and General Description

Section................................................................................................ 1

Changes to Table 1............................................................................ 3

Changes to Table 2............................................................................ 4

Deleted TPC 3; Renumbered Sequentially.................................... 4

Changes to Table 4, Pin 8 Description Column ........................... 5

Changes to Figure 5, Figure 6, Figure 8, and Figure 9 ................. 6

Change to Figure 11 ......................................................................... 7

Changes to Signal Path Section ...................................................... 9

Added Figure 19 ............................................................................. 10

Deleted Figure 14 and Figure 17 .................................................. 12

Deleted Other Versions Section ................................................... 13

Changes to Figure 26...................................................................... 13

Changes to Figure 27...................................................................... 14

Changes to Test Equipment Section ............................................ 15

Added Table 6 ................................................................................. 16

Added Table 7 ................................................................................. 16

Updated Outline Dimensions....................................................... 17

Changes to Ordering Guide .......................................................... 17

3/03—Rev. A to Rev. B

Deleted PDIP Package .......................................................Universal

Change to General Description.......................................................1

Changes to Thermal Characteristics...............................................2

Changes to Ordering Guide .............................................................2

Deleted 14-Lead PDIP, Outline Dimensions .............................. 15

Updated 14-Lead Narrow-Body SOIC, Outline Dimensions... 15