Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  

XPC860PCZP66D4 Datasheet(PDF) 8 Page - Motorola, Inc

Part # XPC860PCZP66D4
Description  Family Hardware Specifications
Download  76 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

XPC860PCZP66D4 Datasheet(HTML) 8 Page - Motorola, Inc

Back Button XPC860PCZP66D4 Datasheet HTML 4Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 5Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 6Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 7Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 8Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 9Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 10Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 11Page - Motorola, Inc XPC860PCZP66D4 Datasheet HTML 12Page - Motorola, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 8 / 76 page
background image
8
MPC860 Family Hardware Specifications
MOTOROLA
Power Dissipation
Part V Power Dissipation
Table 5-4 provides power dissipation information. The modes are 1:1, where CPU and bus
speeds are equal, and 2:1 mode, where CPU frequency is twice bus speed.
NOTE
Values in Table 5-4” represent VDDL-based power dissipation
and do not include I/O power dissipation over VDDH. I/O power
dissipation varies widely by application due to buffer current,
depending on external circuitry.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3 Per JEDEC JESD51-6 with the board horizontal.
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction to case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
Table 5-4. Power Dissipation (PD)
Die Revision
Frequency (MHz)
Typical 1
1 Typical power dissipation is measured at 3.3 V.
Maximum 2
2 Maximum power dissipation is measured at 3.5 V.
Unit
A.3 and Previous
25
450
550
mW
40
700
850
mW
50
870
1050
mW
B.1 and C.1
33
375
TBD
mW
50
575
TBD
mW
66
750
TBD
mW
D.3 and D.4
(1:1 Mode)
50
656
735
mW
66
TBD
TBD
mW
D.3 and D.4
(2:1 Mode)
66
722
762
mW
80
851
909
mW


Similar Part No. - XPC860PCZP66D4

ManufacturerPart #DatasheetDescription
logo
Motorola, Inc
XPC862 MOTOROLA-XPC862 Datasheet
1Mb / 88P
   Hardware Specifications
More results

Similar Description - XPC860PCZP66D4

ManufacturerPart #DatasheetDescription
logo
Motorola, Inc
MPC860EC MOTOROLA-MPC860EC Datasheet
857Kb / 76P
   Family Hardware Specifications
logo
Freescale Semiconductor...
MAC7100 FREESCALE-MAC7100 Datasheet
1Mb / 56P
   Microcontroller Family Hardware Specifications
MPC862 FREESCALE-MPC862_06 Datasheet
1Mb / 88P
   PowerQUICC??Family Hardware Specifications
MPC860 FREESCALE-MPC860_07 Datasheet
1Mb / 80P
   PowerQUICC??Family Hardware Specifications
MPC8270VVUPEA FREESCALE-MPC8270VVUPEA Datasheet
624Kb / 83P
   PowerQUICC II Family Hardware Specifications
MPC8270ZQMIBA FREESCALE-MPC8270ZQMIBA Datasheet
624Kb / 83P
   PowerQUICC II Family Hardware Specifications
MPC8247VRTMFA FREESCALE-MPC8247VRTMFA Datasheet
400Kb / 61P
   PowerQUICC II Family Hardware Specifications
logo
Motorola, Inc
MPC8260AEC MOTOROLA-MPC8260AEC Datasheet
347Kb / 48P
   MPC826xA (HiP4) Family Hardware Specifications
MPC8280 MOTOROLA-MPC8280 Datasheet
1Mb / 76P
   PowerQUICC II Family Hardware Specifications
logo
NXP Semiconductors
MPC860EC NXP-MPC860EC Datasheet
1Mb / 77P
   MPC860 PowerQUICC Family Hardware Specifications
Rev. 10, 09/2015
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com