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TLV70022DDCR Datasheet(PDF) 2 Page - Texas Instruments

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Part # TLV70022DDCR
Description  200-mA, Low-IQ, Low-Dropout Regulator for Portable Devices
Download  35 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV70022DDCR Datasheet(HTML) 2 Page - Texas Instruments

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TLV700xx
SLVSA00D – SEPTEMBER 2009 – REVISED NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
VOUT
(2)
TLV700xx yyy z
XX is nominal output voltage (for example, 28 = 2.8 V).
YYY is the package designator.
Z is tape and reel quantity (R = 3000, T = 250).
(1)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2)
Output voltages from 1.2 V to 4.8 V in 50-mV increments are available. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS
(1)
At TJ = –40°C to +125°C (unless otherwise noted). All voltages are with respect to GND.
PARAMETER
TLV700xx
UNIT
Input voltage range, VIN
–0.3 to +6.0
V
Enable voltage range, VEN
–0.3 to +6.0(2)
V
Output voltage range, VOUT
–0.3 to +6.0
V
Maximum output current, IOUT
Internally limited
Output short-circuit duration
Indefinite
Total continuous power dissipation, PDISS
See Dissipation Ratings Table
Human body model (HBM)
2
kV
ESD rating
Charged device model (CDM)
500
V
Operating junction temperature range, TJ
–55 to +150
°C
Storage temperature range, TSTG
–55 to +150
°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2)
VEN absolute maximum rating is VIN + 0.3 V or 6.0 V, whichever is less.
DISSIPATION RATINGS
DERATING FACTOR
BOARD
PACKAGE
RθJC
RθJA
ABOVE TA = +25°C
TA < +25°C
TA = +70°C
TA = +85°C
Low-K(1)
DCK
165°C/W
395°C/W
2.5 mW/°C
250 mW
140 mW
100 mW
High-K(2)
DCK
165°C/W
315°C/W
3.2 mW/°C
320 mW
175 mW
130 mW
High-K(2)
DSE
67°C/W
180°C/W
4.55 mW/°C
555 mW
305 mW
222 mW
Low-K(1)
DDC
90°C/W
280°C/W
3.6 mW/°C
360 mW
200 mW
145 mW
High-K(2)
DDC
90°C/W
200°C/W
5.0 mW/°C
500 mW
275 mW
200 mW
(1)
The JEDEC low-K (1s) board used to derive this data was a 3-inch × 3-inch, two-layer board with 2-ounce copper traces on top of the
board.
(2)
The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on top and bottom of the board.
2
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Copyright © 2009–2012, Texas Instruments Incorporated


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