PGA5807

SBAS617B – MAY 2013 – REVISED JUNE 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PGA5807

QFN-64

RGC

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range, unless otherwise noted.

(1)

VALUE

UNIT

Supply voltage range

AVDD

–0.3 to 3.9

V

Voltage at analog input and digital input

–0.3 to minimum (3.6, AVDD + 0.3)

V

–40 to +85

°C

Temperature range

–55 to +150

°C

Electrostatic discharge (ESD) ratings

Human body model (HBM)

1

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

AVDD

Analog voltage supply

3.15

3.6

V

Operating temperature

–40

+85

°C

Input common-mode voltage range

1.9

2.3

V

THERMAL INFORMATION

PGA5807

RGC (QFN)

UNITS

64 PINS

Junction-to-ambient thermal resistance

22.8

Junction-to-case (top) thermal resistance

6.9

Junction-to-board thermal resistance

2.4

°C/W

Junction-to-top characterization parameter

0.1

Junction-to-board characterization parameter

2.4

Junction-to-case (bottom) thermal resistance

0.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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