VSMB1940X01

www.vishay.com

Vishay Semiconductors

Rev. 1.4, 02-May-13

4

Document Number: 81933

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

REFLOW SOLDER PROFILE

Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Time between soldering and removing from MBB must not

exceed the time indicated in J-STD-020:



Moisture sensitivity: level 3



Floor life: 168 h



DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

PACKAGE DIMENSIONS in millimeters

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

19841

255 °C

20018