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NCP1117ST12T3G Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP1117ST12T3G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 17 page NCP1117, NCV1117 http://onsemi.com 2 10 mF 1 2 Output 10 mF 3 Input NCP1117 XTXX ++ Figure 1. Fixed Output Regulator 10 mF 1 2 Output 10 mF 3 Input NCP1117 XTA ++ Figure 2. Adjustable Output Regulator 22 mF 1 2 10 mF 3 NCP1117 XT285 ++ 110 W 110 W 110 W 110 W 4.75 V to 5.25 V + 18 to 27 Lines Figure 3. Active SCSI Bus Terminator TYPICAL APPLICATIONS MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) Vin 20 V Output Short Circuit Duration (Notes 2 and 3) − Infinite − Power Dissipation and Thermal Characteristics Case 318H (SOT−223) Power Dissipation (Note 2) Thermal Resistance, Junction−to−Ambient, Minimum Size Pad Thermal Resistance, Junction−to−Case Case 369A (DPAK) Power Dissipation (Note 2) Thermal Resistance, Junction−to−Ambient, Minimum Size Pad Thermal Resistance, Junction−to−Case PD RqJA RqJC PD RqJA RqJC Internally Limited 160 15 Internally Limited 67 6.0 W C/W C/W W C/W C/W Maximum Die Junction Temperature Range TJ −55 to 150 C Storage Temperature Range Tstg −65 to 150 C Operating Ambient Temperature Range NCP1117 NCV1117 TA 0 to +125 −40 to +125 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM), Class 2, 2000 V Machine Model (MM), Class B, 200 V Charge Device Model (CDM), Class IV, 2000 V. 2. Internal thermal shutdown protection limits the die temperature to approximately 175C. Proper heatsinking is required to prevent activation. The maximum package power dissipation is: PD + TJ(max) * TA RqJA 3. The regulator output current must not exceed 1.0 A with Vin greater than 12 V. |
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