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SI8425DB Datasheet(PDF) 9 Page - Vishay Siliconix |
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SI8425DB Datasheet(HTML) 9 Page - Vishay Siliconix |
9 / 11 page AN824 Vishay Siliconix www.vishay.com 2 Document Number: 71990 06-Jan-03 TABLE 1 Main Parameters of Solder Bumps in MICRO FOOT Designs MICRO FOOT CSP Bump Material Bump Pitch* Bump Diameter* Bump Height* MICRO FOOT CSP MOSFET Eutectic Solder: 0.8 0.37-0.41 0.26-0.29 MICRO FOOT CSP Analog Switch Eutectic Solder: 63Sm/37Pb 0.5 0.18-0.25 0.14-0.19 MICRO FOOT UCSP Analog Switch 63Sm/37Pb 0.5 0.32-0.34 0.21-0.24 * All measurements in millimeters MICRO FOOT’S DESIGN AND RELIABILITY As a mechanical, electrical, and thermal connection between the device and PCB, the solder bumps of MICRO FOOT products are mounted on the top active surface of the die. Table 1 shows the main parameters for solder bumps used in MICRO FOOT products. A silicon nitride passivation layer is applied to the active area as the last masking process in fabrication,ensuring that the device passes the pressure pot test. A green laser is used to mark the backside of the die without damaging it. Reliability results for MICRO FOOT products mounted on a FR-4 board without underfill are shown in Table 2. TABLE 2 MICRO FOOT Reliability Results Test Condition C: −65_ to 150_C >500 Cycles Test condition B: −40_ to 125_C >1000 Cycles 121_C @ 15PSI 100% Humidity Test 96 Hours The main failure mechanism associated with wafer-level chip-scale packaging is fatigue of the solder joint. The results shown in Table 2 demonstrate that a high level of reliability can be achieved with proper board design and assembly techniques. BOARD LAYOUT GUIDELINES Board materials. Vishay Siliconix MICRO FOOT products are designed to be reliable on most board types, including organic boards such as FR-4 or polyamide boards. The package qualification information is based on the test on 0.5-oz. FR-4 and polyamide boards with NSMD pad design. Land patterns. Two types of land patterns are used for surface-mount packages. Solder mask defined (SMD) pads have a solder mask opening smaller than the metal pad (Figure 3), whereas on-solder mask defined (NSMD) pads have a metal pad smaller than the solder-mask opening (Figure 4). NSMD is recommended for copper etch processes, since it provides a higher level of control compared to SMD etch processes. A small-size NSMD pad definition provides more area (both lateral and vertical) for soldering and more room for escape routing on the PCB. By contrast, SMD pad definition introduces a stress concentration point near the solder mask on the PCB side that may result in solder joint cracking under extreme fatigue conditions. Copper pads should be finished with an organic solderability preservative (OSP) coating. For electroplated nickel-immersion gold finish pads, the gold thickness must be less than 0.5 mm to avoid solder joint embrittlement. FIGURE 3. SMD FIGURE 4. NSMD Copper Solder Mask Copper Solder Mask |
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