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FAN1655MPX Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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FAN1655MPX Datasheet(HTML) 2 Page - Fairchild Semiconductor |
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2 / 9 page  PRODUCT SPECIFICATION FAN1655 2 REV. 1.1.4 3/24/04 Pin Assignments Pin Definitions Typical Application Pin Pin Name Pin Function Description MLP eTSSOP SOIC-14 1, 4 1, 2, 7 1, 2, 7 VDD Input power for the LDO. 2, 3 3, 6 3, 6 VTTFORCE The VTT output voltage. PAD 4, 5, 8 4, 5, 8 VSS IC Ground. 5109 VTTSENSE Feedback for remote sense of the VTT voltage. 11 10 VREFIN Alternative input for direct control of VTTOUT and VREFOUT. 61211 SHDN Shutdown. This active low shutdown turns off both VTT and VREFOUT. This pin has an internal pull-down, and must be externally driven high for the IC to be on. 13 12 VSSQ Signal Ground. 71413 VREFOUT Buffered Voltage Reference Output. 81514 VDDQ VDDQ Input. Attach this pin to the VDDQ supply to generate VTT and VREFOUT. 9, 16 NC No Internal Connection PADPAD Connect PAD to Vss Ground Plane 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 FAN1655 NC VDDQ VREFOUT VSSQ SHDN VREFIN VTTSENSE NC VDD VDD VTTFORCE VSS VSS VTTFORCE VDD VSS 14 13 12 11 10 9 8 1 2 3 4 5 6 7 FAN1655M VDDQ VREFOUT VSSQ SHDN VREFIN VTTSENSE VSS VDD VDD VTTFORCE VSS VSS VTTFORCE VDD VDDQ VREFOUT SHDN VTTSENSE VDD VTTFORCE VTTFORCE VDD GND 1 2 3 4 8 7 6 5 16-Lead Plastic eTSSOP-16 θJC = 4˚C/W* *Thermal impedance is measured with the power pad soldered to a 0.5 square inch copper area. The copper area should be connected to Vss (ground) and positioned over an internal power or ground plane to assist in heat dissipation. 14-Lead Plastic SOIC θJC = 37˚C/W, θJA = 88˚C/W 8-Lead MLP Package (5x6mm) θJC = 4˚C/W, θJA = 34˚C/W as measured on FAN1655MP Eval Board 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 100 µF 6V 10 µF GND VDD 1nF (connect to VTTFORCE at the load) VTTSENSE 470 µF 10 µF VTTFORCE 1nF GND VREFOUT SHDN VDDQ 10k FAN1655 Figure 1. (eTSSOP pinout shown) |
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