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LM4871MM Datasheet(PDF) 5 Page - Texas Instruments |
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LM4871MM Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 23 page  LM4871 www.ti.com SNAS002F – FEBRUARY 2000 – REVISED MAY 2013 Typical Performance Characteristics NGN Specific Characteristics LM4871LD THD+N vs Output Power LM4871LD THD+N vs Frequency Figure 4. Figure 5. LM4871LD THD+N vs Frequency LM4871LD THD+N vs Output Power Figure 6. Figure 7. LM4871LD Power Dissipation vs Output Power LM4871LD Power Derating Curve This curve shows the LM4871LD's thermal dissipation ability at different ambient temperatures given the exposed-DAP of the part is soldered to a plane of 1oz. Cu with an area given in the label of each curve. This label also designates whether the plane exists on the same (top) layer as the chip, on the bottom layer, or on both layers. Infinite heatsink and unattached (no heatsink) conditions are also shown. Figure 8. Figure 9. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM4871 |
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