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W25Q128FVEIG Datasheet(PDF) 97 Page - Winbond

Part # W25Q128FVEIG
Description  3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q128FVEIG Datasheet(HTML) 97 Page - Winbond

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W25Q128FV
Publication Release Date: October 01, 2012
- 96 -
Revision D
12. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
07/20/2011
New Create Preliminary
B
04/13/2012
10, 14, 84
70
66
84
90
96
6, 9, 87-88, 94-95
Updated RESET descriptions
Updated frequency definition
Referred to SFDP definition application note
Updated Erase Time
Updated WSON metal pad size
Removed preliminary designator
Added VSOP, PDIP package types, Q order option
C
07/13/2012
19, 84
10, 15, 80
95
Updated default driver strength setting
Added power-down requirement
Updated PDIP part number and marking
D
10/01/2012
80
95
Updated power-up timing parameters
Updated WSON part numbers
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Furthermore, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur. Winbond customers using or selling these
products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any
damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document
and the products and services described herein at any time, without notice.


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