VLMTG41S2U1

www.vishay.com

Vishay Semiconductors

Rev. 1.1, 02-May-13

5

Document Number: 83377

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

METHOD OF TAPING/POLARITY AND TAPE AND REEL

SMD LED (VLM.3..., VLM.4...-SERIES)

Vishay’s LEDs in SMD packages are available in an

antistatic 8 mm blister tape (in accordance with DIN IEC 40

(CO) 564) for automatic component insertion. The blister

tape is a plastic strip with impressed component cavities,

covered by a top tape.

TAPING OF VLM.3..., VLM.4...

Fig. 10 - Tape Dimensions in mm for PLCC-2

REEL PACKAGE DIMENSION IN MILLIMETERS

FOR SMD LEDS, TAPE OPTION GS08



(= 1500 PCS.)

Fig. 11 - Reel Dimensions - GS08

REEL PACKAGE DIMENSION IN MILLIMETERS

FOR SMD LEDS, TAPE OPTION GS18



(= 8000 PCS.) PREFERRED

Fig. 12 - Reel Dimensions - GS18

SOLDERING PROFILE

Fig. 13 - Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020)

Fig. 14 - Double Wave Soldering of Opto Devices (all Packages)

Adhesive tape

Component cavity

Blister tape

94 8670

1.85

1.65

4.0

3.6

3.6

3.4

2.05

1.95

1.6

1.4

4.1

3.9

4.1

3.9

5.75

5.25

8.3

7.7

3.5

3.1

2.2

2.0

0.25

94 8668

180

178

4.5

3.5

2.5

1.5

13.00

12.75

63.5

60.5

14.4 max.

10.0

9.0

120°

94 8665

Identification

Label:

Vishay

type

group

tape code

production

code

quantity

321

329

Identification

4.5

3.5

2.5

1.5

13.00

12.75

62.5

60.0

14.4 max.

10.4

8.4

120°

18857

Label:

Vishay

type

group

tape code

production

code

quantity

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s

max. ramp down 6 °C/s

19885

IR Reflow Soldering Profile for Lead (Pb)-free Soldering

Preconditioning acc. to JEDEC level 2a

max. 2 cycles allowed

255 °C

235 °C

to 260 °C

2 K/s

ca. 200 K/s

second

wave

first wave

5 s

full line: typical

dotted line: process limits

Time (s)

lead temperature

300

250

200

150

100

50

0

0

50

100

150

200

250

948626-1

TTW Soldering (acc. to CECC00802)

100 °C

to 130 °C

forced cooling

ca. 2 K/s

ca. 5 K/s