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XPC860DEZP50D3 Datasheet(PDF) 7 Page - Motorola, Inc

Part # XPC860DEZP50D3
Description  Family Hardware Specifications
Download  76 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

XPC860DEZP50D3 Datasheet(HTML) 7 Page - Motorola, Inc

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MOTOROLA
MPC860 Family Hardware Specifications
7
Thermal Characteristics
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC860.
Table 3-2. Maximum Tolerated Ratings
(GND = 0 V)
Rating
Symbol
Value
Unit
Supply Voltage 1
1 The power supply of the device must start its ramp from 0.0 V.
VDDH
–0.3 to 4.0
V
VDDL
–0.3 to 4.0
V
KAPWR
–0.3 to 4.0
V
VDDSYN
–0.3 to 4.0
V
Input Voltage 2
2 Functional operating conditions are provided with the DC electrical specifications in Table 6-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies
to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be
applied to its inputs).
Vin
GND – 0.3 to VDDH
V
Temperature 3 (Standard)
3 Minimum temperatures are guaranteed as ambient temperature, T
A. Maximum temperatures are guaranteed as
junction temperature, Tj.
TA(min)
0˚C
Tj(max)
95
˚C
Temperature 3 (Extended)
TA(min)
–40
˚C
Tj(max)
95
˚C
Storage Temperature Range
Tstg
–55 to 150
˚C
Table 4-3. MPC860 Thermal Resistance Data
Rating
Environment
Symbol
Rev A
Rev
B, C, D
Unit
Junction to Ambient 1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Natural Convection
Single layer board (1s)
RθJA
2
31
40
°C/W
Four layer board (2s2p)
RθJMA
3
20
25
Air Flow (200 ft/min)
Single layer board (1s)
RθJMA
3
26
32
Four layer board (2s2p)
RθJMA
3
16
21
Junction to Board 4
RθJB
815
Junction to Case 5
RθJC
57
Junction to Package Top
6
Natural Convection
ΨJT
12
Air Flow (200 ft/min)
2
3


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