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K005-516 Datasheet(PDF) 2 Page - Eichhoff Electronics,Inc.

Part No. K005-516
Description  Funkenlosch-Kondensatoren Spark Quenching Capacitors Condensateurs d’ extinction
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Maker  EICHHOFF [Eichhoff Electronics,Inc.]
Homepage  http://www.eichhoff.com/
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 2 page
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EICHHOFF Kondensatoren GmbH - Heidgraben 4 - 36110 Schlitz - Germany
sales@eichhoff.de
www.eichhoff.de
Funkenlösch-Kondensatoren – Klasse X1
Spark Quenching Capacitors – Class X1
Condensateurs d’ extinction – Classe X1
Nennkapazität
Nominal value
Capacité nominale
Teile-Nr. / Part number / Référence
Gehäuse
Encapsulation / Boîtier
MB, MBL, IB
Weitere Kapazitäts- und Widerstandswerte auf Anfrage
Other values upon request / D’autres capacités et resistances sur demande
Nennspannung:
Rated voltage:
250 V ~
Tension nominale:
Widerstand:
Resistance:
P 40 = 1 W
Résistance:
Kapazitätsabweichung:
Capacitance tolerance:
r 20%
Tolérances des capacités:
Kondensatorenklasse:
Capacitor class:
X1
Klasse de condensateur:
Klimakategorie:
25/100/21
Climatic category:
(IEC 60068-1)
Catégorie d’ climatique:
Passive Entflammbarkeit:
C
Letter indicating passive
(DIN EN
60384-14)
flammability category:
Catégorie d’ inflammabilité:
Anschlüsse:
Cu-Litze Typ H05V-K 0,5 mm2,
(mit Prüfzeichen
, AWG 20)
Anschlußenden abisoliert
Leads:
stranded copper wire type H05V-K 0.5 mm2
(with Approval
, AWG 20)
ends stripped
Connexions:
toron de cuivre type H05V-K 0,5 mm2,
(avec Homologations
, AWG 20)
bouts dénudés
Prüfzeichen:
Approvals:
Homologations:
Gehäuse:
IB
= Isolierbecher
MB
= Metallbecher
MBL
= Metallbecher mit Lasche
Encapsulation:
IB
= plastic can
MB
= metal can
MBL
= metal can with fixing lug
Boîtier
IB
= boîtier isolant
MB
= boîtier métallique
MBL
= boîtier métallique
avec étrier
I-3
MB
MBL
IB
b r 0,5
Serienwiderstand
Series resistence
Résistance en serie
47 R
47 R
47 R
47 R
38
46
46
53
K005-650/512
K005-750/512
K005-850/512
K005-950/512
K005-650/516
K005-750/516
K005-850/516
K005-950/516
K005-650/515
K005-750/515
K005-850/515
K005-950/515
14
16
18
25
Gehäuse
Encapsulation
Boîtier
MBL
Gehäuse
Encapsulation
Boîtier
MB
2 x 0,024 µF
2 x 0,047 µF
2 x 0,1
µF
2 x 0,2
µF
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EN 60384-14
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