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MPC860EN Datasheet(PDF) 11 Page - Motorola, Inc |
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MPC860EN Datasheet(HTML) 11 Page - Motorola, Inc |
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11 / 76 page  MOTOROLA MPC860 Family Hardware Specifications 11 Estimation with Junction-to-Board Thermal Resistance where: RθJA = junction-to-ambient thermal resistance (ºC/W) RθJC = junction-to-case thermal resistance (ºC/W) RθCA = case-to-ambient thermal resistance (ºC/W) RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most packages, a better model is required. 7.3 Estimation with Junction-to-Board Thermal Resistance A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages and especially PBGA packages is strongly dependent on the board temperature; see Figure 7-1. Figure 7-1. Effect of Board Temperature Rise on Thermal Behavior 0 10 20 30 40 50 60 70 80 90 100 0 2 04 06 0 8 0 Board Temperture Rise Above Ambient Divided by Package Board Temperature Rise Above Ambient Divided by Package Power |
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