W25Q128FVAIP datasheet(9/97 Pages) WINBOND

Part #	W25Q128FVAIP

Description	SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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W25Q128FV

Publication Release Date: October 01, 2012

- 8 -

Revision D

3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)

Figure 1d. W25Q128FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code B & C)

3.7 Ball Description TFBGA 8x6-mm

BALL NO.

PIN NAME

I/O

FUNCTION

B2

CLK

I

Serial Clock Input

B3

GND

Ground

B4

VCC

Power Supply

C2

/CS

I

Chip Select Input

C4

/WP (IO2)

I/O

Write Protect Input (Data Input Output 2)

(2)

D2

DO (IO1)

I/O

Data Output (Data Input Output 1)

(1)

D3

DI (IO0)

I/O

Data Input (Data Input Output 0)

(1)

D4

/HOLD or /RESET

(IO3)

I/O

Hold or Reset Input (Data Input Output 3)

(2)

Multiple

NC

No Connect

Notes:

1. IO0 and IO1 are used for Standard and Dual SPI instructions

2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.

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