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DT2300A Datasheet(PDF) 3 Page - DinTek Semiconductor Co,.Ltd |
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DT2300A Datasheet(HTML) 3 Page - DinTek Semiconductor Co,.Ltd |
3 / 7 page Preliminary Mar 28, 2011 Main Characteristics 10 8 6 4 2 0 0 6 3 9 15 12 0.0001 0.001 0.01 1 0.1 0 0.5 1 1.5 2 2.5 3 0 0.2 0.4 0.6 0.8 1 0 50 100 150 0 3 6 9 12 15 0 0.5 1 1.5 2 2.5 3 3.5 4 Tc = 75°C –25°C 25°C VDS = 10 V Pulse Test 0 1 1.5 0.5 –25 0 25 50 75 100 125 150 VDS = 10 V Pulse Test VDS = 10 V Pulse Test Tc = 75°C 25°C –25°C VGS = 0 V Pulse Test Tc = 25 °C 1.6 V 1.8 V 2.0 V 10 V 2.2 V 3 V 1.4 V 0.01 0.1 1 10 100 0.01 0.1 1 10 100 Ta = 25°C 1 Shot Pulse 100 μs PW = 100 ms 1 ms 10 ms DC Operation ID = 10 mA 1 mA 0.1 mA Ambient Temperature Ta (°C) Maximum Channel Power Dissipation Curve Maximum Safe Operation Area Drain to Source Voltage VDS (V) Typical Output Characteristics Drain to Source Voltage VDS (V) Typical Transfer Characteristics (1) Gate to Source Voltage VGS (V) Typical Transfer Characteristics (2) Gate to Source Voltage VGS (V) Gate to Source Cutoff Voltage vs. Case Temperature Case Temperature Tc (°C) *When using the glass epoxy board (FR-4: 40 × 40 × 1 mm) Operation in this area is limited by RDS(on) DINDS0301EJ0400 Rev.4.00 Page 3 of 6 |
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