© 1999 Fairchild Semiconductor Corporation

DS500154

www.fairchildsemi.com

July 1999

Revised August 1999

74LVT244 •74LVTH244

Low Voltage Octal Buffer/Line Driver

with 3-STATE Outputs

General Description

The LVT244 and LVTH244 are octal buffers and line drivers

designed to be employed as memory address drivers,

clock drivers and bus oriented transmitters or receivers

which provide improved PC board density.

The LVTH244 data inputs include bushold, eliminating the

need for external pull-up resistors to hold unused inputs.

These octal buffers and line drivers are designed for low-

provide a TTL interface to a 5V environment. The LVT244

and LVTH244 are fabricated with an advanced BiCMOS

technology to achieve high speed operation similar to 5V

ABT while maintaining low power dissipation.

Features

s Input and output interface capability to systems at

s Bushold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH244),

also available without bushold feature (74LVT244)

s Live insertion/extraction permitted

s Power Up/Down high impedance provides glitch-free

bus loading

s Outputs source/sink

−32 mA/+64 mA

s Functionally compatible with the 74 series 244

s Latch-up performance exceeds 500 mA

Ordering Code:

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.

Logic Symbol

IEEE/IEC

Order Number

Package Number

Package Description

74LVT244WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide

74LVT244SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

74LVT244MSA

MSA20

20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide

74LVT244MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

74LVTH244WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide

74LVTH244SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

74LVTH244MSA

MSA20

20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide

74LVTH244MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide