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HT32 Datasheet(PDF) 5 Page - Littelfuse |
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HT32 Datasheet(HTML) 5 Page - Littelfuse |
5 / 8 page 341 ©2008 Littelfuse, Inc. Revised: July 9, 2008 Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 341 ©2008 Littelfuse, Inc. Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. HTxxx & HTMxxx & STxxx Series Standard Bidirectional DIAC Trigger Physical Specifications Terminal Finish 100% Matte-Tin Plated/ Pb-Free Solder Dipped Body Material DO-214: UL recognized epoxy meeting flammabilty classification 94V-0. DO-35/MINIMELF: Glass case body Lead Material DO-214: Copper Alloy DO-35/MINIMELF: Copper Clad Iron Reliability/Environmental Tests Test Specifications and Conditions High Temperature Voltage Blocking MIL-STD-750, M-1040, Cond A Applied 80% of Rated Min V BO (VAC-peak) @ 125°C for 1008 hours Temperature Cycling MIL-STD-750, M-1051, 100 cycles; -40°C to +150°C; 15-min dwell-time Temperature/ Humidity EIA / JEDEC, JESD22-A101 1008 hours; 80% of Rated Min V BO (VDC): 85°C; 85% rel humidity High Temp Storage MIL-STD-750, M-1031,1008 hours; 150°C Low-Temp Storage 1008 hours; -40°C Thermal Shock MIL-STD-750, M-1056 10 cycles; 0°C to 100°C; 5-min dwell time at each temperature; 10 sec (max) transfer time between temperature Autoclave EIA / JEDEC, JESD22-A102 168 hours (121°C at 2 ATMs) and 100% R/H Resistance to Solder Heat MIL-STD-750 Method 2031 Solderability ANSI/J-STD-002, category 3, Test A Lead Bend MIL-STD-750, M-2036 Cond E Burn-in 1 firing per 1/2 cycle, 168 hours Dimensions – MINIMELF / SOD-80 (MM Package) A C C D B .002 E-F E F Dimensions Inches Millimeters Min Typ Max Min Typ Max A 0.125 0.134 0.142 3.18 3.40 3.61 B 0.066 0.068 0.070 1.68 1.73 1.78 C 0.012 0.018 0.020 0.30 0.46 0.51 D — 0.063 — — 1.60 — Design Considerations Dimensions – DO-35 (Y Package) C B B A E TYP. D (TYP.) Dimension Inches Millimeters Min Max Min Max A (Note 1) 0.060 0.090 1.530 2.280 B (Note 2) 0.015 0.381 C (Note 1) 0.135 0.165 3.430 4.190 D 0.018 0.022 0.458 0.558 E 1.000 25.400 Notes: 1. Package contour optional within dimensions A and C. Slugs, if any, shall be included within this cylinger but shall not be subject to the minimum limit of Dimention A. 2. Lead diameter is not controlled in this zone to allow for flash, lead finish build-up and minor irregularities other than slugs. Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Overheating and surge currents are the main killers of DIACs. Correct mounting, soldering, and forming of the leads also help protect against component damage. |
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