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MBD4448HTW Datasheet(PDF) 1 Page - Taiwan Semiconductor Company, Ltd |
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MBD4448HTW Datasheet(HTML) 1 Page - Taiwan Semiconductor Company, Ltd |
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1 / 2 page  MBD4448HAQW/HADW/HCDW/HSDW/HTW Switching Diode Small Signal Diode Surface device type mounting Moisture sensitivity level 1 High Conductance Power Dissipation For General Purpose Switching Applications Pb free version and RoHS compliant Min Max Min Max Case :SOT-363 small outline plastic package 0.071 0.079 1.800 2.000 0.045 0.053 1.150 1.350 0.006 0.012 0.150 0.300 - 0.043 - 1.100 Part No. Package Packing Code Packing MBD4448HAQW SOT-363 RF 3K / 7" Reel MBD4448HADW SOT-363 RF 3K / 7" Reel MBD4448HCDW SOT-363 RF 3K / 7" Reel MBD4448HSDW SOT-363 RF 3K / 7" Reel MBD4448HTW SOT-363 RF 3K / 7" Reel MBD4448HAQW SOT-363 RFG 3K / 7" Reel MBD4448HADW SOT-363 RFG 3K / 7" Reel MBD4448HCDW SOT-363 RFG 3K / 7" Reel MBD4448HSDW SOT-363 RFG 3K / 7" Reel MBD4448HTW SOT-363 RFG 3K / 7" Reel Maximum Ratings ‘@ t=1μs ’@ t=1s V mA Non-Repetitive Peak Forward Surge Current 0.051BSC 1.300BSC 0.083BSC 2.100BSC mA Power Dissipation Type Number SOT-363 Note1. Device mounted on FR-4 PCB, 1 inch×0.85 inch×0.062 inch Repetitive Peak Reverse Voltage Rating at 25°C ambient temperature unless otherwise specified. Units mW 80 A V Reverse Voltage Average Rectified Forward Current VR IF(AV) 57 500 250 IFSM 4 VRRM Average Rectified Output Current IO Symbol 0.420 PD 200 0.017 Value D E F Maximum Ratings and Electrical Characteristics High temperature soldering guaranteed: 260°C/10s G Pin Configuration Ordering Information Features Mechanical Data Unit (mm) A Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed Fast switching speed Unit (inch) Dimensions Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code B C 1.5 Thermal Resistance (Junction to Ambient) RθJA 625 °C/W Junction and Storage Temperature Range TJ, TSTG -55 to + 150 °C MBD4448HAQW MBD4448HCDW MBD4448HADW MBD4448HTW MBD4448HSDW Version : B12 |
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