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XBDAMB-00-0000-000000701 Datasheet(PDF) 1 Page - Cree, Inc |
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XBDAMB-00-0000-000000701 Datasheet(HTML) 1 Page - Cree, Inc |
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1 / 17 page  Product family data sheet Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. cree ® Xlamp® XB-d leds Product descriPtioN The XLamp XB-D LeD brings next- generation performance, price and size to all LeD lighting applications. The XB-D’s footprint enables smaller designs with densely packed arrays for better light mixing and concentration. XB-D shares common footprint and uniform package design across all white and color configurations, simplifying board and optical designs for many LeD systems. XB-D is optimized to dramatically lower system cost in any illumination application, from indoor and outdoor lighting to architectural and transportation lighting. features • Cree’s smallest lighting class LeD: 2.45 X 2.45 mm • XB-D white binned @ 85 °C; XB-D color binned @ 25 °C • Up to 136 lm/W in cool white (@ 85 °C, 350 mA) • Available in white, 80-minimum CRI white, and 70-minimum CRI cool white, royal blue, blue, green, amber, red-orange & red • 1 A maximum drive current • Wide viewing angle: from 115° (white) to 140° (red) • Reflow solderable - JEDEC J-STD-020C compatible • Unlimited floor life at ≤ 30 °C/85% RH • electrically neutral thermal path • RoHS- and REACh-compliant • UL-recognized component (e349212) Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 taBle of coNteNts Characteristics ......................... 2 Flux Characteristics................... 3 Relative Spectral power Distribution.............................. 6 Relative Flux vs. Junction Temperature ............................ 7 electrical Characteristics............ 8 Thermal Design........................ 9 Relative Flux vs. Current ......... 10 Relative Chromaticity vs. Current ................................. 11 Relative Chromaticity vs. Temperature .......................... 12 Typical Spatial Distribution....... 12 Reflow Soldering Characteristics 13 Notes.................................... 14 mechanical Dimensions............ 15 Tape and Reel ........................ 16 packaging.............................. 17 |
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Similar Description - XBDAMB-00-0000-000000701 |
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