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NTCS0603E3103MT Datasheet(PDF) 6 Page - Vishay Siliconix |
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NTCS0603E3103MT Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 7 page 2381 615 3..../NTCS0603E3.....T Vishay BCcomponents SMD 0603, Glass Protected NTC Thermistors www.vishay.com For technical questions, contact: nlr@vishay.com Document Number: 29056 32 Revision: 22-Apr-09 SOLDERING CONDITIONS This SMD thermistor is only suitable for wave or reflow soldering, in accordance with “CECC 00802”. The maximum temperature of 260 °C during 40 s should not be exceeded. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. TESTS AND REQUIREMENTS PACKAGING TAPE SPECIFICATIONS All tape specifications are in accordance with “IEC 60286-3”. Basic dimensions are given below. Carrier tape material is paper. PAPER TAPE Notes (1) Measured 0.3 mm above base pocket (2) P0 pitch cumulative error over any 10 pitches ± 0.2 mm Time (s) 0 50 100 150 200 200 250 100 150 50 0 300 250 260 °C ≈ 245 °C 215 °C 180 °C 130 °C 2 K/s 40 s 10 s 10 s Reflow Soldering Lead (Pb)-free Reflow Soldering Profile 260 °C ≈ 245 °C 235 °C ≈ 170 °C ≈ 120 °C 2 K/s max. Time (s) 0 50 100 150 200 350 200 250 100 150 50 0 300 40 s max. ≈ 60 s 20 s min. normal limit 250 300 6 K/s max. 2.4 1.0 0.8 Dimensions of the solder lands SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT IEC 60068-2-58 TEST METHOD TEST PROCEDURE REQUIREMENTS 6TC Solderability 2 s at 235 °C Min. 95 % of surface wetted Resistance to soldering heat 10 s at 260 °C ΔR/R < 5 % F W P0 P2 D 0 B0 A0 P1 E1 T T1 DIMENSIONS OF PAPER TAPE in millimeters PARAMETER DIMENSION TOLERANCE A0 (1) 1.15 ± 0.1 B0 (1) 1.9 ± 0.1 W8.0 ± 0.2 E1 1.75 ± 0.1 F 3.5 ± 0.05 D0 1.55 ± 0.05 P0 (2) 4.0 ± 0.1 P1 4.0 ± 0.1 P2 2.0 ± 0.05 T tape thickness 1.1 max. T1 cover tape < 0.1 - |
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