2381 615 3..../NTCS0603E3.....T

Vishay BCcomponents

SMD 0603, Glass Protected

NTC Thermistors

www.vishay.com

Document Number: 29056

32

Revision: 22-Apr-09

SOLDERING CONDITIONS

This SMD thermistor is only suitable for wave or reflow soldering, in accordance with “CECC 00802”. The maximum temperature

of 260 °C during 40 s should not be exceeded.

Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.

TESTS AND REQUIREMENTS

PACKAGING

TAPE SPECIFICATIONS

PAPER TAPE

Notes

Time (s)

0

50

100

150

200

200

250

100

150

50

0

300

250

260 °C

≈ 245 °C

215 °C

180 °C

130 °C

2 K/s

40 s

10 s

10 s

Reflow Soldering

Lead (Pb)-free Reflow Soldering Profile

260 °C

≈ 245 °C

235 °C

≈ 170 °C

≈ 120 °C

2 K/s

max.

Time (s)

0

50

100

150

200

350

200

250

100

150

50

0

300

40 s max.

≈ 60 s

20 s min.

normal

limit

250

300

6 K/s

max.

2.4

1.0

0.8

Dimensions of the solder lands

SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT

IEC 60068-2-58

TEST METHOD

TEST

PROCEDURE

REQUIREMENTS

Solderability

2 s at 235 °C

Min. 95 % of surface wetted

Resistance to soldering heat

10 s at 260 °C

ΔR/R < 5 %

F

W

P0

P2

D 0

B0

A0

P1

E1

T

T1

DIMENSIONS OF PAPER TAPE in millimeters

PARAMETER

DIMENSION

TOLERANCE

1.15

± 0.1

1.9

± 0.1

W8.0

± 0.2

1.75

± 0.1

F

3.5

± 0.05

1.55

± 0.05

4.0

± 0.1

4.0

± 0.1

2.0

± 0.05

T tape thickness

1.1

max.

< 0.1

-