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D2570H867 Datasheet(PDF) 2 Page - Agere Systems |
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D2570H867 Datasheet(HTML) 2 Page - Agere Systems |
2 / 12 page 2 Agere Systems Inc. D2570, D2526G, D2555 Wavelength-Selected Data Sheet, Rev. 3 Direct Modulated Isolated DFB Laser Module July 2001 Description (continued) Controlled Feedback The module contains an internal optical isolator that suppresses optical feedback in laser-based, fiber-optic systems. Light reflected back to the laser is attenuated a minimum of 30 dB. Controlled Temperature An integral thermoelectric cooler (TEC) provides stable thermal characteristics. The TEC allows for heating and cooling of the laser chip to maintain a temperature of 25 °C for case temperatures from –40 °C to +70 °C. The laser temperature is monitored by the internal thermistor, which can be used with external circuitry to control the laser chip temperature. Controlled Power An internal, InGaAs, PIN photodiode functions as the back-facet monitor. The photodiode monitors emission from the rear facet of the laser and, when used in con- junction with control circuitry, can control optical power launched into the fiber. Normally, this configuration is used in a feedback arrangement to maintain consistent laser output power. Standard Package The laser module is fabricated in a 14-pin, hermetic, metal/ceramic butterfly package that incorporates a bias tee, which separates the dc-bias path from the RF input. The RF input has a nominal 25 Ω impedance. The laser module is equipped with SMF-28 * type fiber. The fiber has a 900 µm tight buffer jacket. Various con- nectors and pigtail lengths are available. Agere Systems’ optoelectronic components are being qualified to rigorous internal standards that are consis- tent with Telcordia Technologies TR-NWT-000468. All design and manufacturing operations are ISO * 9001 certified. The module is being fully qualified for central office applications. * ISO is a registered trademark of The International Organization for Standardization. † SMF-28 is a trademark of Corning Inc. Pin Information * A positive current through the thermoelectric heat pump cools the laser. † Both leads should be grounded for optimum performance. Top view. Figure 1. Circuit Schematic Pin Name 1 Thermistor 2 Thermistor 3 Laser dc Bias (Cathode) (–) 4 Back-facet Monitor Anode (–) 5 Back-facet Monitor Cathode (+) 6 Thermoelectric Cooler (+)* 7 Thermoelectric Cooler (–)† 8 Case Ground 9 Case Ground 10 Case Ground 11 Laser Anode (+)† 12 RF Laser Input Cathode (–) 13 Laser Anode (+)† 14 Case Ground 1-567F.b TEC L1 160 nH ISOLATOR R1 20 Ω PACKAGE GROUNDS ++ – – +– + 76 5 4 3 2 1 8 9 10 11 12 13 TH 10 k Ω NC 14 – |
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