MAX17501AATB datasheet(2/22 Pages) MAXIM

Part #	MAX17501AATB

Description	60V, 500mA, Ultra-Small, High-Efficiency, Synchronous Step-Down DC-DC Converter

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Manufacturer	MAXIM [Maxim Integrated Products]

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MAX17501

60V, 500mA, Ultra-Small, High-Efficiency,

Synchronous Step-Down DC-DC Converter

www.maximintegrated.com

Maxim Integrated │ 2

Electrical Characteristics

(VIN = 24V, VGND = VPGND = 0V, CVIN = CVCC=1μF,VEN = 1.5V, CSS = 3300pF, VFB = 0.98 x VOUT, LX = unconnected, RESET

= unconnected. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to

GND,unlessotherwisenoted.)(Note2)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

VINtoGND.............................................................-0.3Vto+70V

EN/UVLOtoGND.......................................-0.3V to (VIN + 0.3V)

LXtoPGND................................................-0.3V to (VIN + 0.3V)

FB,RESET,COMP,SStoGND .............................-0.3V to +6V

VCCtoGND..............................................................-0.3Vto+6V

GNDtoPGND.......................................................-0.3Vto+0.3V

LXTotalRMSCurrent.........................................................±1.6A

Output Short-Circuit Duration.....................................Continuous

Continuous Power Dissipation (TA = +70°C)

(derate 14.9mW/°C above +70°C) (multilayer board).1188.7mW

OperatingTemperatureRange.........................-40°Cto+125°C

Junction Temperature......................................................+150°C

StorageTemperatureRange.............................-65°Cto+160°C

Lead Temperature (soldering, 10s).................................+300°C

Soldering Temperature (reflow).......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 1)

TDFN

Junction-to-AmbientThermalResistance(θJA) .......67.3°C/W

Junction-to-CaseThermalResistance(θJC)............18.2°C/W

Absolute Maximum Ratings

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT SUPPLY (VIN)

InputVoltageRange

VIN

4.5

60

V

Input Supply Current

IIN-SH

VEN = 0V, shutdown mode

0.9

3.5

µA

IIN-HIBERNATE VFB = 1.03 x VOUT,MAX17501A/B

90

145

IIN-SW

Normal

switching mode,

no load

MAX17501E/F/G

4.75

6.75

mA

MAX17501H

2.5

3.6

ENABLE/UVLO (EN/UVLO)

EN Threshold

VENR

VEN rising

1.194

1.218

1.236

V

VENF

VEN falling

1.114

1.135

1.156

VEN-TRUESD VEN falling, true shutdown

0.7

EN Input Leakage Current

IEN

VEN = VIN = 60V, TA = +25°C

8

200

nA

LDO

VCCOutputVoltageRange

VCC

6V < VIN < 12V, 0mA < IVCC < 10mA,

12V < VIN < 60V, 0mA < IVCC < 2mA

4.65

5

5.35

V

VCC Current Limit

IVCC-MAX

VCC = 4.3V, VIN = 12V

15

40

80

mA

VCC Dropout

VCC-DO

VIN = 4.5V, IVCC = 5mA

4.1

V

VCC UVLO

VCC-UVR

VCC rising

3.85

4

4.15

V

VCC-UVF

VCC falling

3.55

3.7

3.85

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MAX17501AATB Datasheet(PDF) 2 Page - Maxim Integrated Products

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