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NCP1529MU12TBG Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP1529MU12TBG Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 16 page NCP1529 http://onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit Minimum Voltage All Pins Vmin −0.3 V Maximum Voltage All Pins (Note 2) Vmax 7.0 V Maximum Voltage EN Vmax VIN + 0.3 V Thermal Resistance, Junction−to−Air (TSOP−5 Package) Thermal Resistance using TSOP−5 Recommended Board Layout (Note 9) RqJA 300 110 °C/W Thermal Resistance, Junction−to−Air (UDFN6 Package) Thermal Resistance using UDFN6 Recommended Board Layout (Note 9) RqJA 220 40 °C/W Operating Ambient Temperature Range (Notes 7 and 8) TA −40 to 85 °C Storage Temperature Range Tstg −55 to 150 °C Junction Operating Temperature (Notes 7 and 8) Tj −40 to 150 °C Latchup Current Maximum Rating (TA = 85°C) (Note 5) Other Pins Lu $100 mA ESD Withstand Voltage (Note 4) Human Body Model Machine Model Vesd 2.0 200 kV V Moisture Sensitivity Level (Note 6) MSL 1 per IPC Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C. 3. According to JEDEC standard JESD22−A108B. 4. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) per JEDEC standard: JESD22−A114. Machine Model (MM) per JEDEC standard: JESD22−A115. 5. Latchup current maximum rating per JEDEC standard: JESD78. 6. JEDEC Standard: J−STD−020A. 7. In applications with high power dissipation (low VIN, high IOUT), special care must be paid to thermal dissipation issues. Board design considerations − thermal dissipation vias, traces or planes and PCB material − can significantly improve junction to air thermal resistance RqJA (for more information, see design and layout consideration section). Environmental conditions such as ambient temperature TA brings thermal limitation on maximum power dissipation allowed. The following formula gives calculation of maximum ambient temperature allowed by the application: TA MAX = TJ MAX − (RqJA x Pd) Where: TJ is the junction temperature, Pd is the maximum power dissipated by the device (worst case of the application), and RqJA is the junction−to−ambient thermal resistance. 8. To prevent permanent thermal damages, this device include a thermal shutdown which engages at 180°C (typ). 9. Board recommended TSOP−5 and UDFN6 layouts are described on Layout Considerations section. Figure 7. Maximum Output Current, TA = 455C 0 200 400 600 800 1000 1200 −40 −20 0 20 406080 TA, AMBIENT TEMPERATURE (°C) Figure 8. Power Derating TSOP−5 UDFN6 0 200 400 600 800 1000 1200 2.7 3.2 3.7 4.2 4.7 5.2 VIN, INPUT VOLTAGE (V) TSOP−5 UDFN6 |
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