www.dynexsemi.com

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic

semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages

and current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.

The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of

our customers.

Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete

Solution (PACs).

HEATSINKS

The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to

optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow

rates) is available on request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or

Customer Services.

CUSTOMER SERVICE

Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020

© Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN

UNITED KINGDOM

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.

Lincolnshire. LN6 3LF. United Kingdom.

Tel: +44-(0)1522-500500

Fax: +44-(0)1522-500550

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded

as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company

reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee

that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure

that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

http://www.dynexsemi.com

e-mail: power_solutions@dynexsemi.com

Stresses above those listed in this data sheet may cause permanent damage to the device. In extreme conditions, as with all

semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always

be followed.