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OP493EP Datasheet(PDF) 6 Page - Analog Devices |
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OP493EP Datasheet(HTML) 6 Page - Analog Devices |
6 / 16 page REV. A –6– OP193/OP293/OP493 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Differential Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . ±18 V Output Short-Circuit Duration to Gnd . . . . . . . . . . Indefinite Storage Temperature Range P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range OP193/OP293/OP493E, F . . . . . . . . . . . . –40 °C to +125°C Junction Temperature Range P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300 °C Package Type θ JA 3 θ JC Units 8-Pin Plastic DIP (P) 103 43 °C/W 8-Pin SOIC (S) 158 43 °C/W 14-Pin Plastic DIP (P) 83 39 °C/W 16-Pin SOL (S) 92 27 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2For supply voltages less than ±18 V, the input voltage is limited to the supply voltage. 3 θ JA is specified for the worst case conditions, i.e., θ JA is specified for device in socket for P-DIP, and θ JA is specified for device soldered in circuit board for SOIC package. WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP193/OP293/OP493 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Temperature Package Package Model Range Description Option OP193EP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP193ES –40 °C to +125°C 8-Pin SOIC SO-8 OP193ES-REEL –40 °C to +125°C 8-Pin SOIC SO-8 OP193ES-REEL7 –40 °C to +125°C 8-Pin SOIC SO-8 OP193FP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP193FS –40 °C to +125°C 8-Pin SOIC SO-8 OP193FS-REEL –40 °C to +125°C 8-Pin SOIC SO-8 OP193FS-REEL7 –40 °C to +125°C 8-Pin SOIC SO-8 OP193GBC +25 °C DICE OP293EP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP293ES –40 °C to +125°C 8-Pin SOIC SO-8 OP293ES-REEL –40 °C to +125°C 8-Pin SOIC SO-8 OP293ES-REEL7 –40 °C to +125°C 8-Pin SOIC SO-8 OP293FP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP293FS –40 °C to +125°C 8-Pin SOIC SO-8 OP293FS-REEL –40 °C to +125°C 8-Pin SOIC SO-8 OP293FS-REEL7 –40 °C to +125°C 8-Pin SOIC SO-8 OP293GBC +25 °C DICE OP493EP –40 °C to +125°C 14-Pin Plastic DIP N-14 OP493ES –40 °C to +125°C 16-Pin SOL SOL-16 OP493ES-REEL –40 °C to +125°C 16-Pin SOL SOL-16 OP493FP –40 °C to +125°C 14-Pin Plastic DIP N-14 OP493FS –40 °C to +125°C 16-Pin SOL SOL-16 OP493FS-REEL –40 °C to +125°C 16-Pin SOL SOL-16 OP493GBC +25 °C DICE DICE CHARACTERISTICS 2 1 34 6 5 8 7 OP493 Die Size 0.106 × 0.143 Inch, 15,158 Sq. Mils Substrate (Die Backside) Is Connected to V– Transistor Count, 215 2 1 3 4 6 5 7 OP193 Die Size 0.070 × 0.055 Inch, 3,850 Sq. Mils Substrate (Die Backside) Is Connected to V– Transistor Count, 55 2 1 34 6 5 8 7 OP293 Die Size 0.072 × 0.110 Inch, 7,920 Sq. Mils Substrate (Die Backside) Is Connected to V– Transistor Count, 105 |
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