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OP400AY Datasheet(PDF) 4 Page - Analog Devices

Part # OP400AY
Description  Quad Low-Offset, Low-Power Operational Amplifier
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

OP400AY Datasheet(HTML) 4 Page - Analog Devices

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–4–
OP400
REV. A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
OP400 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
DIE SIZE 0.181
0.123 inch, 22,263 sq. milts
(4.60
3.12 mm, 14.35 sq. mm)
ORDERING INFORMATION
TA = 25 C
Package
Operating
VOS Max
CerDIP
Temperature
(mV)
14-Lead
Plastic
Range
150
OP400AY
MIL
150
OP400EY
IND
230
OP400FY
IND
300
OP400GP
COM
300
OP400GS
COM
300
OP400HP
XIND
300
OP400HS
XIND
NOTES
1For devices processed in total compliance to MIL-STD-883, add/883after part
number. Consult factory for 883 data sheet.
2Burn-in is available on commercial and industrial temperature range parts in
CerDIP, plastic DIP, and TO-can packages.
For Military processed devices, please refer to the standard
microcircuit drawing (SMD) available at
www.dscc.dla.mil/programs/milspec/default.asp
SMD Part Number
ADI Equivalent
5962-8777101M3A
OP400ATCMDA
5962-8777101MCA
OP400AYMDA
OP400GBC
Parameter
Symbol
Conditions
Limit
Unit
Input Offset Voltage
VOS
230
mA Max
Input Offset Current
VOS
VCM = 0 V
2
nA Max
Input Bias Current
IB
VCM = 0 V
6
nA Max
Large Signal
AVO
VO =
±10 V RL = 10 kW
3000
Voltage Gain
Rig 2 k
W
1500
V/mV Min
Input Voltage Range*
IVR
*
±12
V Min
Common Mode Rejection
CMR
VCM =
±12 V
115
dB Min
Power Supply Rejection Ratio
PSRR
VS =
±3 V to ±18 V
3.2
mV/V Max
Output Voltage Swing
VO
RL = 10 k
W
RL = 2 k
W±12
V Min
Supply Current Per Amplifier
ISY
No Load
725
mA Max
NOTE
*
Guaranteed by CMR test.
Electrical tests are performed at wafer probe to the limits shown Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
1. OUT A
8. OUT C
2. –IN A
9. –IN C
3. +INA
10. +IN C
4. V+
11. V-
5. +IN B
12. +IND
6. –IN B
13. –IN D
7. OUT B
14. OUT D
DICE CHARACTERISTICS
WAFER TEST LIMITS (@ V
S =
15 V, TA = 25 C, unless otherwise noted.)


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