UCC28710, UCC28711

UCC28712, UCC28713

UCC28714, UCC28715

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SLUSB86 – NOVEMBER 2012

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VDD

Bias supply operating voltage

9

35

V

VDD bypass capacitor

0.047

1

µF

Cable-compensation resistance

10

k

Ω

VS pin current

−1

mA

Operating junction temperature

−40

125

°C

THERMAL INFORMATION

UCC28710

UCC28711

UCC28712

UCC28713

UNITS

UCC28714

UCC28715

D

7 PINS

141.5

73.8

89.0

°C/W

23.5

88.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

Copyright © 2012, Texas Instruments Incorporated

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