INA282, INA283

INA284, INA285

INA286

SBOS485B – NOVEMBER 2009 – REVISED SEPTEMBER 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

PACKAGE

PRODUCT

GAIN

PACKAGE

DESIGNATOR

MARKING

INA282

50V/V

SOIC-8

D

I282A

INA283

200V/V

SOIC-8

D

I283A

INA284

500V/V

SOIC-8

D

I284A

INA285

1000V/V

SOIC-8

D

I285A

INA286

100V/V

SOIC-8

D

I286A

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or

refer to the device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

INA282, INA283,

INA284, INA285, INA286

UNIT

Supply Voltage

+18

V

(3)

–5 to +5

V

Analog Inputs,

(2)

Common-Mode

–14 to +80

V

Ref1, Ref2, Out

GND–0.3 to (V+) + 0.3

V

Input Current into Any Pin

5

mA

Storage Temperature

–65 to +150

°C

Junction Temperature

+150

°C

Human Body Model (HBM)

3000

V

ESD Ratings:

Charged-Device Model (CDM)

1000

V

Machine Model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

(3)

Input voltages must not exceed common-mode rating.

THERMAL INFORMATION

INA282AID,

INA283AID,

INA284AID,

INA285AID,

UNITS

INA286AID

D

8

Junction-to-ambient thermal resistance

134.9

Junction-to-case (top) thermal resistance

72.9

Junction-to-board thermal resistance

61.3

°C/W

Junction-to-top characterization parameter

18.9

Junction-to-board characterization parameter

54.3

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Links: INA282 INA283 INA284 INA285 INA286