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ADG704BRM Datasheet(PDF) 4 Page - Analog Devices |
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ADG704BRM Datasheet(HTML) 4 Page - Analog Devices |
4 / 8 page ADG704 –4– REV. A CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG704 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE TERMINOLOGY VDD Most positive power supply potential. GND Ground (0 V) reference. S Source terminal. May be an input or output. D Drain terminal. May be an input or output. A0, A1 Logic control inputs. EN Logic control input. RON Ohmic resistance between D and S. ∆R ON On resistance match between any two chan- nels i.e., RONmax–RONmin. RFLAT(ON) Flatness is defined as the difference between the maximum and minimum value of on resis- tance as measured over the specified analog signal range. ID (OFF) Drain leakage current with the switch “OFF.” IS (OFF) Source leakage current with the switch “OFF.” ID, IS (ON) Channel leakage current with the switch “ON.” VD (VS) Analog voltage on terminals D, S. CS (OFF) “OFF” switch source capacitance. CD (OFF) “OFF” switch drain capacitance. CD, CS (ON) “ON” switch capacitance. tON Delay between applying the digital control input and the output switching on. See Test Circuit 4. tOFF Delay between applying the digital control input and the output switching off. tD “OFF” time or “ON” time measured between the 90% points of both switches, when switching from one address state to another. See Test Circuit 5. Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an “OFF” switch. Charge A measure of the glitch impulse transferred Injection from the digital input to the analog output during switching. Bandwidth The frequency at which the output is attenu- ated by –3 dBs. On Response The frequency response of the “ON” switch. On Loss The voltage drop across the “ON” switch, seen on the On Response vs. Frequency plot as how many dBs the signal is away from 0 dB at very low frequencies. Table I. Truth Table A1 A0 EN ON Switch X X 0 NONE 00 1 1 01 1 2 10 1 3 11 1 4 ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V Analog, Digital Inputs 2 . . . . . . . . . . . –0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA (Pulsed at 1 ms, 10% Duty Cycle Max) Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C µSOIC Package, Power Dissipation . . . . . . . . . . . . . . . 315 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. ORDERING GUIDE Temperature Package Model Range Brand 1 Option 2 ADG704BRM –40 °C to +85°C S9B RM-10 NOTES 1Brand = Due to small package size, these three characters represent the part number. 2RM = µSOIC. PIN CONFIGURATION (10-Lead SOIC) TOP VIEW (Not to Scale) 10 9 8 7 6 1 2 3 4 5 A0 S1 GND S3 EN A1 S2 D S4 VDD ADG704 |
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