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ADG601BRM Datasheet(PDF) 4 Page - Analog Devices |
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ADG601BRM Datasheet(HTML) 4 Page - Analog Devices |
4 / 8 page REV. 0 ADG601/ADG602 –4– ABSOLUTE MAXIMUM RATINGS 1 (TA = 25 °C unless otherwise noted) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V Analog Inputs 2 . . . . . . . . . . . . . . . . . V SS –0.3 V to VDD +0.3 V Digital Inputs 2 . . . . . . . . . . . . . . . . . . . . –0.3 V to V DD +0.3 V or 30 mA, whichever occurs first Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . 200 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150 °C Micro-SOIC Package θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W SOT_23 Package θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6°C/W θJC Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99°C/W Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300 °C IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. ORDERING GUIDE Model Temperature Range Package Description Package Option Branding Information* ADG601BRT –40 °C to +85°C Plastic Surface-Mount (SOT_23) RT-6 STB ADG601BRM –40 °C to +85°C Micro Small Outline (Micro-SOIC) RM-8 STB ADG602BRT –40 °C to +85°C Plastic Surface-Mount (SOT_23) RT-6 SUB ADG602BRM –40 °C to +85°C Micro Small Outline (Micro-SOIC) RM-8 SUB *Branding on SOT_23 and Micro-SOIC packages is limited to three characters due to space constraints. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG601/ADG602 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE PIN CONFIGURATIONS 6-Lead Plastic Surface Mount (SOT_23) (RT-6) TOP VIEW (Not to Scale) 8 7 6 1 2 3 VDD S VSS IN D GND ADG601/ ADG602 8-Lead Small Outline Micro-SOIC (RM-8) TOP VIEW (Not to Scale) 8 7 6 5 1 2 3 4 NC = NO CONNECT D NC NC VDD S GND IN VSS ADG601/ ADG602 |
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Similar Description - ADG601BRM |
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