AD9631/AD9632

REV. A

–3–

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V

Voltage Swing

× Bandwidth Product . . . . . . . . . .550 V × MHz

Internal Power Dissipation

2

Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Watts

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . 0.9 Watts

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .

±1.2 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range N, R . . . . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . . . – 40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300

°C

NOTES

permanent damage to the device. This is a stress rating only, and functional

operation of the device at these or any other conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

8-Pin Plastic Package:

θ

8-Pin SOIC Package:

θ

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by these de-

vices is limited by the associated rise in junction temperature.

The maximum safe junction temperature for plastic encapsu-

lated devices is determined by the glass transition temperature

of the plastic, approximately +150

°C. Exceeding this limit tem-

porarily may cause a shift in parametric performance due to a

change in the stresses exerted on the die by the package. Exceed-

ing a junction temperature of +175

°C for an extended period can

result in device failure.

While the AD9631 and AD9632 are internally short circuit pro-

tected, this may not be sufficient to guarantee that the maxi-

mum junction temperature (+150

°C) is not exceeded under all

conditions. To ensure proper operation, it is necessary to ob-

serve the maximum power derating curves.

2.0

0

–50

80

1.5

0.5

–40

1.0

0

10

–10

–20

–30

20

30

40

50

60

70

90

AMBIENT TEMPERATURE –

8-PIN MINI-DIP PACKAGE

8-PIN SOIC PACKAGE

Figure 2. Plot of Maximum Power Dissipation vs.

Temperature

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although these devices feature proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

METALIZATION PHOTO

Dimensions shown in inches and (mm).

0.046

(1.17)

3

+IN

4

6

OUT

–IN

2

7

AD9631

0.050 (1.27)

0.046

(1.17)

0.050 (1.27)

3

+IN

4

6

OUT

–IN

2

7

AD9632

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description Option*

AD9631AN

–40C to +85

°C

Plastic DIP

N-8

AD9631AR

–40

°C to +85°C

SOIC

R-8

AD9631(SMD)

–55

°C to +125°C Cerdip

Q-8

AD9631-EB

Evaluation

Board

AD9632AN

–40

°C to +85°C

Plastic DIP

N-8

AD9632AR

–40

°C to +85°C

SOIC

R-8

AD9632-EB

Evaluation

Board

*N = Plastic DIP; Q = Cerdip; R= SOIC (Small Outline Integrated Circuit).