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ATC100B240JT500XT Datasheet(PDF) 2 Page - Freescale Semiconductor, Inc |
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ATC100B240JT500XT Datasheet(HTML) 2 Page - Freescale Semiconductor, Inc |
2 / 19 page 2 RF Device Data Freescale Semiconductor MRF6V2300NR1 MRF6V2300NBR1 Table 4. Moisture Sensitivity Level Test Methodology Rating Package Peak Temperature Unit Per JESD22--A113, IPC/JEDEC J--STD--020 3 260 °C Table 5. Electrical Characteristics (TA =25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Off Characteristics Zero Gate Voltage Drain Leakage Current (VDS = 100 Vdc, VGS =0 Vdc) IDSS — — 2.5 mA Zero Gate Voltage Drain Leakage Current (VDS =50 Vdc, VGS =0 Vdc) IDSS — — 50 μAdc Drain--Source Breakdown Voltage (ID = 150 mA, VGS =0 Vdc) V(BR)DSS 110 — — Vdc Gate--Source Leakage Current (VGS =5 Vdc, VDS =0 Vdc) IGSS — — 10 μAdc On Characteristics Gate Threshold Voltage (VDS =10 Vdc, ID = 800 μAdc) VGS(th) 1 1.63 3 Vdc Gate Quiescent Voltage (VDD =50 Vdc, ID = 900 mAdc, Measured in Functional Test) VGS(Q) 1.5 2.6 3.5 Vdc Drain--Source On--Voltage (VGS =10 Vdc, ID =2 Adc) VDS(on) — 0.28 — Vdc Dynamic Characteristics Reverse Transfer Capacitance (VDS =50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc) Crss — 2.88 — pF Output Capacitance (VDS =50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc) Coss — 120 — pF Input Capacitance (VDS =50 Vdc, VGS =0 Vdc ± 30 mV(rms)ac @ 1 MHz) Ciss — 268 — pF Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD =50 Vdc, IDQ = 900 mA, Pout = 300 W, f = 220 MHz, CW Power Gain Gps 24 25.5 27 dB Drain Efficiency ηD 66 68 — % Input Return Loss IRL — --16 --9 dB Typical Performances (In Freescale 27 MHz and 450 MHz Test Fixtures, 50 ohm system) VDD =50 Vdc, IDQ = 900 mA, Pout = 300 W CW Power Gain f = 27 MHz f = 450 MHz Gps — — 31.4 21.7 — — dB Drain Efficiency f = 27 MHz f = 450 MHz ηD — — 61.5 59.1 — — % Input Return Loss f = 27 MHz f = 450 MHz IRL — — --17.4 --24.4 — — dB ATTENTION: The MRF6V2300N and MRF6V2300NB are high power devices and special considerations must be followed in board design and mounting. Incorrect mounting can lead to internal temperatures which exceed the maximum allowable operating junction temperature. Refer to Freescale Application Note AN3263 (for bolt down mounting) or AN1907 (for solder reflow mounting) PRIOR TO STARTING SYSTEM DESIGN to ensure proper mounting of these devices. |
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