AN30181A

2

Ver. BEB

ABSOLUTE MAXIMUM RATINGS

*1

*3

V

LX1,LX2,PCNT,PCNTB,DIS,

RESET,BUF,VREG

Output Voltage Range

*1

*3

V

EN,FB1,FB2

Input Voltage Range

-

kV

2

HBM (Human Body Model)

*2

°C

– 40 to + 150

Operating junction temperature

ESD

*2

°C

– 55 to + 150

Storage temperature

Notes

Unit

Rating

Symbol

Parameter

*2

°C

– 40 to + 85

Operating free-air temperature

*1

*3

V

6.0

Supply voltage

Notes) Do not apply external currents and voltages to any pin not specifically mentioned.

This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.

This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated

recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product

may be affected.

*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.

*2:Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25

°C.

*3:V

POWER DISSIPATION RATING

*1

Notes

0.765 W

1.472 W

84.9

°C /W

9pin Wafer level chip size package

(WLCSP Type)

PD(Ta=85

°C)

PD(Ta=25

°C)

θ

JA

PACKAGE

Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power supply

voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not

exceed the allowable value.

*1:Glass Epoxy Substrate(4 Layers) [Glass-Epoxy: 50 X 50 X 0.8t(mm)]

Die Pad Exposed , Soldered.

CAUTION

Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.

Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates