MMA955xL

Sensors

8

Freescale Semiconductor, Inc.

• General-Purpose Timer/PWM Module (TPM)

– System Integration Module (SIM)

– Clock-Generation Module

ing while the device is in low-power, deep-sleep mode.

3.2

Packaging Information

The package pinout definition for this device is designed as a super set of functions found typically on Freescale’s ColdFire V1

CPU offering, as well as other competitive devices. All pins on the device are utilized and many are multiplexed.

The following sections describe the pinout. Users can select from multiple pin functions via the SIM pin, mux-control registers.

3.2.1

Package diagrams

Figure 2. Device pinout (top view) and package frame convention

1

2

3

4

5

67

8

9

13

12

11

10

16 15 14

RGPIO7/AN1/TPMCH1

BKGD-MS/RGPIO9

RESETB

SCL0/RGPIO0/SCLK

RGPIO6/AN0/TPMCH0

RGPIO5/PDB_A/INT_O

RGPIO4/INT

Direction of the

detectable accelerations

X

Y

Z

1

(TOP VIEW)