IB054Q096T70N1-00

IBC MODULE

Rev 1.9

vicorpower.com

Page 11 of 14

11/2012

800 735.6200

Parallel Operation

The IBC will inherently current share when operated in an array. Arrays may

be used for higher power or redundancy in an application. Current sharing

accuracy is maximized when the source and load impedance presented to

each IBC within an array are equal. The recommended method to achieve

matched impedances is to dedicate common copper planes within the PCB

to deliver and return the current to the array, rather than rely upon traces

of varying lengths. In typical applications the current being delivered to the

load is larger than that sourced from the input, allowing narrower traces to

be utilized on the input side if necessary. The use of dedicated power

planes is, however, preferable.

One or more IBCs in an array may be disabled without adversely affecting

operation or reliability as long as the load does not exceed the rated power

of the enabled IBCs.

The IBC power train and control architecture allow bi-directional power

transfer, including reverse power processing from the IBC output to its

input. The IBC’s ability to process power in reverse improves the IBC tran-

sient response to an output load dump.

Thermal Considerations

The temperature distribution of the VI Brick can vary significantly

with its input/ output operating conditions, thermal management and

environmental conditions. Although the PCB is UL rated to 130 °C, it is

recommended that PCB temperatures be maintained at or below 125 °C.

For maximum long term reliability, lower PCB temperatures are

recommended for continuous operation, however, short periods of

operation at 125 °C will not negatively impact performance or reliability.

WARNING: Thermal and voltage hazards. The IBC can operate with surface

temperatures and operating voltages that may be hazardous to personnel.

Ensure that adequate protection is in place to avoid inadvertent contact.

Input Impedance Recommendations

To take full advantage of the IBC capabilities, the impedance presented to

its input terminals must be low from DC to approximately 5 MHz.

The source should exhibit low inductance and should have a critically

damped response. If the interconnect inductance is excessive, the IBC input

pins should be bypassed with an RC damper (e.g., 47

μFinserieswith

0.3

Ω)toretainlowsourceimpedanceandproperoperation.Giventhe

wide bandwidth of the IBC, the source response is generally the limiting

factor in the overall system response.

Anomalies in the response of the source will appear at the output of the

IBC multiplied by its K factor. The DC resistance of the source should be

kept as low as possible to minimize voltage deviations. This is especially

important if the IBC is operated near low or high line as the

overvoltage / undervoltage detection circuitry could be activated.

Input Fuse Recommendations

The IBC is not internally fused in order to provide flexibility in configuring

power systems. However, input line fusing of VI Bricks must always be

incorporated within the power system. A fast acting fuse should be placed

in series with the +In port. See safety agency approvals.

Application Notes

For IBC and VI Brick application notes on soldering, thermal management,

board layout, and system design visit vicorpower.com.

APPLICATIONS NOTE

Product

Input

Package

Nominal

Temperature

Output

Enable

Pin

Options

Family

Voltage

Output Voltage

Grade

Current

Logic

Length

IB

054

Q

096

T

70

N = Negative

1 = 0.145

-00 = Open frame

P = Positive

2 = 0.210

-BP = Baseplate

3 = 0.180

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