160 CLA

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Revision: 04-Dec-12

4

Document Number: 28405

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS

ACCORDING TO JEDEC J-STD-020

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Notes

• Temperature measuring point on top of the case and on terminals.

• Max. 2 runs with pause of min. 30 min in between.

REFLOW SOLDERING CONDITIONS for MAL216099xxxE3

PROFILE FEATURES

CASE CODE

1213 TO 1216

CASE CODE

1616 TO 1821

300 s

300 s

Min. ramp-up rate to 150 °C

3 K/s

3 K/s

150 s

150 s

110 s

110 s

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

90 s

90 s

65 s

60 s

250 °C

245 °C

30 s

30 s

3 K/s to 6 K/s

3 K/s to 6 K/s

t

1

200

190

150

25

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4