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BCL016B Datasheet(PDF) 4 Page - BeRex Corporation |
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BCL016B Datasheet(HTML) 4 Page - BeRex Corporation |
4 / 5 page www.berex.com BeRex, Inc. 1735 North 1 st Street #302 San Jose, CA 95112 T: (408) 452-5595; F: (408) 452-5596 Nov. 2012 Specifications are subject to change without notice. ©BeRex 2012 Rev. 1.7 BCL016B PIN_POUT/Gain, PAE (12 GHz) Frequency = 12GHz VDS = 2 V, IDS = 10 mA (Tuned for Power) WIRE BONDING INFORMATION Always follow wire bonding diagrams recommended by BeRex for each device to achieve optimum device performance and reliability. As a general rule, bonding temperature should be kept to a maximum of 280°C for no longer than 2 minutes for all bonding wires. Using 1 mil. Diameter, Au bonding wires. 1. Gate to input transmission line - Length and Height : 500 µm x 250 µm - Number of wire(s): 1 2. Drain to output transmission line - Length and Height : 500 µm x 250 µm - Number of wire(s) : 1 3. Source to ground plate - Length and Height : 350 µm x 200 µm - Number of wire(s) : 4 |
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