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MAX14571 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX14571 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 14 page 2 Maxim Integrated Adjustable Overvoltage and Overcurrent Protectors with High Accuracy MAX14571/MAX14572/MAX14573 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (All voltages referenced to GND.) IN, HVEN ................................................................-40V to +40V IN to OUT ...............................................................-40V to +40V OUT ......................................................................-0.3V to +40V OVLO, UVLO, FLAG, EN, RIEN............................-0.3V to +6.0V Current into IN (DC Operating) (Note 1).............. ………….4.2A SETI .......................... ………….-0.3V to Min (VIN, 1.22V) + 0.3V Continuous Power Dissipation (TA = +70NC) TSSOP (derate 25.6mW/NC above +70NC)........ ….2051.3mW Operating Temperature Range.......................... -40NC to +85NC Junction Temperature ........................................………..+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................. …………+300NC Soldering Temperature (reflow) ....................... …………+260NC ELECTRICAL CHARACTERISTICS ( VIN = 4.5V to 36V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VIN = 24V, RISET = 12kI, TA = +25°C.) (Note 3) ABSOLUTE MAXIMUM RATINGS PACKAGE THERMAL CHARACTERISTICS (Note 2) Note 1: DC current is also limited by the thermal design of the system. TSSOP Junction-to-Ambient Thermal Resistance (BJA) ........... +39NC/W Junction-to-Case Thermal Resistance (BJC).................. +3NC/W Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS IN Voltage Range VIN 4.5 36 V Shutdown Input Current ISHDN VEN = 0V, VHVEN = 5V 15 F A Shutdown Output Current IOFF VOUT = 0V 2 F A Reverse Input Current IIN_RVS VIN = -40V, VOUT = VGND = 0V -35 F A Supply Current IIN VIN = 15V, RISET = 12kI 490 700 F A Internal Overvoltage Trip Level VOVLO VIN rising 32 33 34 V VIN falling 32 Internal Undervoltage Trip Level VUVLO VIN falling 17.5 18.5 19.5 V VIN rising 18.2 19.2 20.2 Overvoltage-Lockout Hysteresis % of typical OVLO 3 % External OVLO Adjustment Range (Note 4) 6 36 V External OVLO Select Voltage VOVLOSEL 0.3 0.50 V External OVLO Leakage Current IOVLO_LEAK VOVLO < 1.2V (Note 5) -100 +100 nA External UVLO Adjustment Range 4.5 24 V External UVLO Select Voltage VOVLOSEL 0.3 0.50 V External UVLO Leakage Current IUVLO_LEAK (Note 5) -100 +100 nA BG Reference Voltage VBG 1.186 1.210 1.234 V |
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