HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : MOS200613

Issued Date : 2006.07.01

Revised Date : 2006.07.12

Page No. : 3/4

H2302N

HSMC Product Specification

SOT-23 Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

H

J

K

D

A

L

G

V

C

B

3

2

1

S

DIM

Min.

Max.

A

2.80

3.04

B

1.20

1.60

C

0.89

1.30

D

0.30

0.50

G

1.70

2.30

H

0.013

0.10

J

0.085

0.177

K

0.32

0.67

L

0.85

1.15

S

2.10

2.75

V

0.25

0.65

*: Typical, Unit: mm

Marking:

23

Pb Free Mark

Normal: None

02

Note: Pb-free product can distinguish by the

green label or the extra description on the

right side of the label.

Pin Style: 1.Gate 2.Source 3.Drain

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead SOT-23 Plastic

Surface Mounted Package

HSMC Package Code: N