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0314010.HXP Datasheet(PDF) 2 Page - Littelfuse |
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0314010.HXP Datasheet(HTML) 2 Page - Littelfuse |
2 / 3 page Introduction to Circuit Protection Introduction to Circuit Protection Transientology 322 © 2009 Littelfuse, Inc. Specifications are subject to change without notice. Axial Lead & Cartridge Fuses 314/324 Series 3AB > Fast Acting > 314/324 Series Please refer to www.littelfuse.com/series/314.html or /324.html for current information. Average Time Current Curves 1000 100 10 1 0.1 0.01 0.1 1 10 100 1000 CURRENT IN AMPERES Temperature Rerating Curve Soldering Parameters - Wave Soldering Dwell Time 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 Time (Seconds) Cooling Time Preheat Time Wave Parameter Lead-Free Recommendation Preheat: (Depends on Flux Activation Temperature) (Typical Industry Recommendation) Temperature Minimum: 100 ° C Temperature Maximum: 150 ° C Preheat Time: 60-180 seconds Solder PotTemperature: 260 ° C Maximum Solder DwellTime: 2-5 seconds Recommended Hand-Solder Parameters: Solder Iron Temperature: 350° C +/- 5°C Note: These devices are not recommended for IR or Convection Reflow process. Recommended Process Parameters: |
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