W83193R-01

PRELIMINARY

Publication Release Date: May 1998

- 10 -

Revision 0.20

8.0 SPECIFICATIONS

8.1 ABSOLUTE MAXIMUM RATINGS

Stresses greater than those listed in this table may cause permanent damage to the device.

Precautions should be taken to avoid application of any voltage higher than the maximum rated

voltages to this circuit. Maximum conditions for extended periods may affect reliability.

Unused

inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).

Symbol

Parameter

Rating

Voltage on any pin with respect to GND

- 0.5 V to + 7.0 V

Storage Temperature

- 65

°C to + 150°C

Ambient Temperature

- 55

°C to + 125°C

Operating Temperature

0

°C to + 70°C

8.2 AC CHARACTERISTICS

Vdd = Vddq3 = 3.3V

Parameter

Symbol

Min

Typ

Max

Units

Test Conditions

Output Duty Cycle

45

50

55

%

Measured at 1.5V

CPU/SDRAM to PCI Offset

1

4

ns

15 pF Load Measured at 1.5V

Skew

(CPU-CPU),

(PCI-

PCI), (SDRAM-SDRAM)

250

ps

15 pF Load Measured at 1.5V

CPU/SDRAM

Cycle to Cycle Jitter

¡Ó250

ps

CPU/SDRAM

Absolute Jitter

500

ps

Jitter Spectrum 20 dB

Bandwidth from Center

500

KHz

Output Rise (0.4V ~ 2.0V)

& Fall (2.0V ~0.4V) Time

0.4

1.6

ns

15 pF Load on CPU and PCI

outputs

Overshoot/Undershoot

Beyond Power Rails

0.7

1.5

V

22

Ω at source of 8 inch PCB

run to 15 pF load

Ring Back Exclusion

0.7

2.1

V

Ring Back must not enter this

range.