Introduction to Circuit Protection

Introduction to Circuit Protection

Transientology

224

© 2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Axial Lead & Cartridge Fuses

265/266/267 Series

Please refer to www.littelfuse.com/series/265.html /

266.html/or /267.html for current information.

Average Time Current Curves

100

10

1

0.1

0.01

0.001

10

100

1000

0.1

1

CURRENT IN AMPERES

Temperature Rerating Curve

Soldering Parameters\

Dwell Time

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100

Temperature Maximum:

150

Preheat Time:

60-180 seconds

Solder PotTemperature:

280

Solder DwellTime:

2-5 seconds

Recommended Hand-Solder Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.

Note: These devices are not recommended for IR or

Convection Reflow process.

Recommended Process Parameters:

Note:

1. Derating depicted in this curve is in addition to the standard derating of 25% for

continuous operation.