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RT9526GE Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9526GE Datasheet(HTML) 9 Page - Richtek Technology Corporation |
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9 / 10 page  RT9526A 9 DS9526A-01 April 2011 www.richtek.com Figure 4. PCB Layout Guide Layout Consideration The RT9526A is a fully integrated low cost single-cell Li- ion battery charger ideal for portable applications. Careful PCB layout is necessary. For best performance, place all peripheral components as close to the IC as possible. A short connection is highly recommended. The following guidelines should be strictly followed when designing a PCB layout for the RT9526A. Input capacitor should be placed close to the IC and connected to the ground plane. The trace of input on the PCB should be placed far away from the sensitive devices and shielded by the ground. The GND and exposed pad should be connected to a strong ground plane for heat sinking and noise protection. The connection of RISET should be isolated from other noisy traces. Output capacitor should be placed close to the IC and connected to the ground plane to reduce noise coupling. Figure 3. Derating Curve for RT9526A Package ISET VIN ENB PGB BATT GND CHG_SB 7 6 5 1 2 3 4 8 9 IMIN BATT BATT VIN BATT COUT CIN R1 R2 RISET RIMIN GND CIN should be placed near the IC to improve performance. The copper area connecting the resistors of ISET and IMIN should be minimized and kept far away from noise sources. The GND plane should be connected to a strong ground plane for heat sinking and noise protection. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB PD(MAX) = (125 °C − 25°C) / (120°C/W) = 0.833W for WDFN-8L 2x3 package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. For the RT9526A packages, the derating curves in Figure 3 allow the designer to see the effect of rising ambient temperature on the maximum power dissipation. |
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Similar Description - RT9526GE |
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