RT6030 datasheet(9/10 Pages) RICHTEK

Part #	RT6030

Description	4-CH LED Current Source Controller

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Manufacturer	RICHTEK [Richtek Technology Corporation]

Direct Link	http://www.richtek.com

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9

RT6030

DS6030-02 March 2011

www.richtek.com

PD(MAX) = (125

°C − 25°C) / (95°C/W) = 1.053W for

SOP-16 package

The maximum power dissipation depends on the operating

ambient temperature for fixed TJ(MAX) and thermal

resistance,

θJA. For the RT6030 package, the derating

curve in Figure 1 allows the designer to see the effect of

rising ambient temperature on the maximum power

dissipation.

Figure 1. Derating Curve for RT6030 Package

Layout Considerations

There are three critical layout considerations.

First the current setting resistor should be placed as

close as possible to the RT6030 to prevent any noise

coupling.

Second of all CIN and COUT should be placed near the

RT6030 for good performance.

Last of all, proper copper area for the pass element

should be acknowledged. Pass elements operating

under high power situations can result in abnormally

junction temperature. In addition to the package thermal

resistance limit, the copper area should be increased

accordingly to improve the power dissipation.

VCC12

EN2

FB2

DRI2

EN4

GND

FB4

DRI1

FB1

GND

EN1

FB3

DRI3

EN3

DRI4

VCC34

6

7

8

4

5

2

3

16

13

15

14

12

9

11

10

GND

RDRI3

R3

VCC

C12

VLED

RDRI1

R1

R2

RDRI2

VCC

GND

RDRI4

R4

C34

The GND plane should be

connected to a strong ground

plane for heat sinking and

noise protection.

CIN should be placed near the

IC for improve performance.

FBx node copper area

should be minimized

and kept far away

from noise sources.

VLED

Figure 2. PCB Layout Guide

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

1.10

025

50

75

100

125

Ambient Temperature (°C)

Single-Layer PCB

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