NDT451AN Rev. D1

Typical Thermal Characteristics

0

0.2

0.4

0.6

0.8

1

3

4

5

6

7

8

2oz COPPER MOUNTING PAD AREA (in )

2

1c

1b

1a

4.5"x5" FR-4 Board

T = 25 C

Still Air

V

= 10V

A

o

GS

Figure 13. Maximum Steady-State Drain Current

versus Copper Mounting Pad Area.

0.1

0.2

0.5

1

2

5

10

30

50

0.01

0.05

0.1

0.2

0.5

1

5

10

30

V

, DRAIN-SOURCE VOLTAGE (V)

DS

1s

100ms

10s

10ms

RDS(ON)

LIMIT

DC

1ms

V

= 10V

SINGLE PULSE

R

= See Note 1c

T

= 25°C

GS

A

100us

Figure 14. Maximum Safe Operating Area.

Figure 15. Transient Thermal Response Curve

.

Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.

0

0.2

0.4

0.6

0.8

1

0.5

1

1.5

2

2.5

3

3.5

2oz COPPER MOUNTING PAD AREA (in )

2

1c

1b

1a

4.5"x5" FR-4 Board

T = 25 C

Still Air

A

o

Figure 12. SOT-223 Maximum Steady-State

Power Dissipation versus Copper

Mounting Pad Area.

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1

2

R

(t) = r(t) * R

R

= See Note 1 c

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)